{"isi":1,"article_processing_charge":"No","has_accepted_license":"1","day":"04","file":[{"date_updated":"2023-05-30T07:38:44Z","date_created":"2023-05-30T07:38:44Z","file_size":5640829,"creator":"dernst","access_level":"open_access","relation":"main_file","checksum":"23893be46763c4c78daacddd019de821","file_id":"13099","success":1,"content_type":"application/pdf","file_name":"2023_ACSAppliedMaterials_Nan.pdf"}],"doi":"10.1021/acsami.3c00625","file_date_updated":"2023-05-30T07:38:44Z","publisher":"American Chemical Society","oa":1,"date_created":"2023-05-28T22:01:03Z","pmid":1,"language":[{"iso":"eng"}],"acknowledgement":"Open Access is funded by the Austrian Science Fund (FWF). We thank Generalitat de Catalunya AGAUR─2021 SGR 01581 for financial support. B.F.N., K.X., and L.L.Y. thank the China Scholarship Council (CSC) for the scholarship support. C.C. acknowledges funding from the FWF “Lise Meitner Fellowship” grant agreement M 2889-N. J.S.L is grateful to the Science and Technology Department of Sichuan Province for the project no. 22NSFSC0966. K.H.L. was supported by the Institute of Zhejiang University-Quzhou (IZQ2021RCZX003). M.I. acknowledges the financial support from IST Austria.","abstract":[{"text":"There is a need for the development of lead-free thermoelectric materials for medium-/high-temperature applications. Here, we report a thiol-free tin telluride (SnTe) precursor that can be thermally decomposed to produce SnTe crystals with sizes ranging from tens to several hundreds of nanometers. We further engineer SnTe–Cu2SnTe3 nanocomposites with a homogeneous phase distribution by decomposing the liquid SnTe precursor containing a dispersion of Cu1.5Te colloidal nanoparticles. The presence of Cu within the SnTe and the segregated semimetallic Cu2SnTe3 phase effectively improves the electrical conductivity of SnTe while simultaneously reducing the lattice thermal conductivity without compromising the Seebeck coefficient. Overall, power factors up to 3.63 mW m–1 K–2 and thermoelectric figures of merit up to 1.04 are obtained at 823 K, which represent a 167% enhancement compared with pristine SnTe.","lang":"eng"}],"publication_identifier":{"issn":["1944-8244"],"eissn":["1944-8252"]},"intvolume":"        15","tmp":{"name":"Creative Commons Attribution 4.0 International Public License (CC-BY 4.0)","short":"CC BY (4.0)","image":"/images/cc_by.png","legal_code_url":"https://creativecommons.org/licenses/by/4.0/legalcode"},"type":"journal_article","author":[{"full_name":"Nan, Bingfei","first_name":"Bingfei","last_name":"Nan"},{"full_name":"Song, Xuan","first_name":"Xuan","last_name":"Song"},{"full_name":"Chang, Cheng","orcid":"0000-0002-9515-4277","last_name":"Chang","id":"9E331C2E-9F27-11E9-AE48-5033E6697425","first_name":"Cheng"},{"first_name":"Ke","last_name":"Xiao","full_name":"Xiao, Ke"},{"first_name":"Yu","last_name":"Zhang","full_name":"Zhang, Yu"},{"first_name":"Linlin","last_name":"Yang","full_name":"Yang, Linlin"},{"full_name":"Horta, Sharona","first_name":"Sharona","id":"03a7e858-01b1-11ec-8b71-99ae6c4a05bc","last_name":"Horta"},{"full_name":"Li, Junshan","last_name":"Li","first_name":"Junshan"},{"last_name":"Lim","first_name":"Khak Ho","full_name":"Lim, Khak Ho"},{"orcid":"0000-0001-5013-2843","full_name":"Ibáñez, Maria","first_name":"Maria","id":"43C61214-F248-11E8-B48F-1D18A9856A87","last_name":"Ibáñez"},{"full_name":"Cabot, Andreu","last_name":"Cabot","first_name":"Andreu"}],"quality_controlled":"1","publication_status":"published","date_published":"2023-05-04T00:00:00Z","date_updated":"2023-08-01T14:50:09Z","volume":15,"project":[{"name":"Bottom-up Engineering for Thermoelectric Applications","_id":"9B8804FC-BA93-11EA-9121-9846C619BF3A","grant_number":"M02889"}],"ddc":["540"],"scopus_import":"1","year":"2023","article_type":"original","status":"public","oa_version":"Published Version","publication":"ACS Applied Materials and Interfaces","external_id":{"isi":["000985497900001"],"pmid":["37141543"]},"issue":"19","department":[{"_id":"MaIb"}],"user_id":"4359f0d1-fa6c-11eb-b949-802e58b17ae8","title":"Bottom-up synthesis of SnTe-based thermoelectric composites","month":"05","_id":"13092","citation":{"ama":"Nan B, Song X, Chang C, et al. Bottom-up synthesis of SnTe-based thermoelectric composites. <i>ACS Applied Materials and Interfaces</i>. 2023;15(19):23380–23389. doi:<a href=\"https://doi.org/10.1021/acsami.3c00625\">10.1021/acsami.3c00625</a>","ista":"Nan B, Song X, Chang C, Xiao K, Zhang Y, Yang L, Horta S, Li J, Lim KH, Ibáñez M, Cabot A. 2023. Bottom-up synthesis of SnTe-based thermoelectric composites. ACS Applied Materials and Interfaces. 15(19), 23380–23389.","ieee":"B. Nan <i>et al.</i>, “Bottom-up synthesis of SnTe-based thermoelectric composites,” <i>ACS Applied Materials and Interfaces</i>, vol. 15, no. 19. American Chemical Society, pp. 23380–23389, 2023.","chicago":"Nan, Bingfei, Xuan Song, Cheng Chang, Ke Xiao, Yu Zhang, Linlin Yang, Sharona Horta, et al. “Bottom-up Synthesis of SnTe-Based Thermoelectric Composites.” <i>ACS Applied Materials and Interfaces</i>. American Chemical Society, 2023. <a href=\"https://doi.org/10.1021/acsami.3c00625\">https://doi.org/10.1021/acsami.3c00625</a>.","short":"B. Nan, X. Song, C. Chang, K. Xiao, Y. Zhang, L. Yang, S. Horta, J. Li, K.H. Lim, M. Ibáñez, A. Cabot, ACS Applied Materials and Interfaces 15 (2023) 23380–23389.","apa":"Nan, B., Song, X., Chang, C., Xiao, K., Zhang, Y., Yang, L., … Cabot, A. (2023). Bottom-up synthesis of SnTe-based thermoelectric composites. <i>ACS Applied Materials and Interfaces</i>. American Chemical Society. <a href=\"https://doi.org/10.1021/acsami.3c00625\">https://doi.org/10.1021/acsami.3c00625</a>","mla":"Nan, Bingfei, et al. “Bottom-up Synthesis of SnTe-Based Thermoelectric Composites.” <i>ACS Applied Materials and Interfaces</i>, vol. 15, no. 19, American Chemical Society, 2023, pp. 23380–23389, doi:<a href=\"https://doi.org/10.1021/acsami.3c00625\">10.1021/acsami.3c00625</a>."},"page":"23380–23389"}